Defence Technology

Packaging and Integration

Cordon Electronics Italia offers Microwave Chip&Wire packaging and integration services in clean room facility, providing turnkey solutions from components to sub-systems, to satisfy Customer demands of samples, pre-series and production.

Assembly and testing operations are performed in a 900 sqm ISO 8 clean room facility and in a 900 sqm ESD production area:

  • Processes for adhesive and solder paste dispensing
  • Components placement process (MMICs)
  • Connection equipments (wire and ribbon bonding)
  • Subsystem integration
  • MW tests and ESS
  • Qualification tests