Packaging and Integration
Cordon Electronics Italia offers Microwave Chip&Wire packaging and integration services in clean room facility, providing turnkey solutions from components to sub-systems, to satisfy Customer demands of samples, pre-series and production.
Assembly and testing operations in a 1,300 sqm ISO 7 clean room:
- Thick film (ceramic substrate)
- Manufacturing lines including:
- Processes for adhesive and solder paste dispensing
- Components placement process (MMICs)
- Connection equipments (wire and ribbon bonding)
- Subsystem integration
- MW tests and ESS
- Qualification tests
MW Interconnections
RF customised interconnection solutions of flexible and semi rigid cables internal capability
