Packaging and Integration


Cordon Electronics Italia offers Microwave Chip&Wire packaging and integration services in clean room facility, providing turnkey solutions from components to sub-systems, to satisfy Customer demands of samples, pre-series and production.


Assembly and testing operations in a 1,300 sqm ISO 7 clean room:

  • Thick film (ceramic substrate)
  • Manufacturing lines including:
    • Processes for adhesive and solder paste dispensing
    • Components placement process (MMICs)
    • Connection equipments (wire and ribbon bonding)
    • Subsystem integration
    • MW tests and ESS
  • Qualification tests
MMIC die-attach and wire-bonding in RF cavity

MW Interconnections


RF customised interconnection solutions of flexible and semi rigid cables internal capability

Cordon ISO 7 Clean Room