Packaging and Integration


Cordon Electronics Italia offers Microwave Chip&Wire packaging and integration services in clean room facility, providing turnkey solutions from components to sub-systems, to satisfy Customer demands of samples, pre-series and production.


Assembly and testing operations in a 1,300 sqm ISO 7 clean room:

  • Thick film (ceramic substrate)
  • Manufacturing lines including:
    • Processes for adhesive and solder paste dispensing
    • Components placement process (MMICs)
    • Connection equipments (wire and ribbon bonding)
    • MW tests
Assembly operations in ISO 7 clean room
After sales service



Pre-Commissioning of final product integration and functional tests.

Pre-commission integration